Super High-Speed Die Bonder "ADAT3 XF Series"
Achieves a processing capacity of 72K UPH and high-precision bonding. Supports flip chips and various processes, contributing to improved productivity in semiconductor manufacturing.
The ultra-high-speed die bonder "ADAT3 XF" series for semiconductor assembly features the "DBSG" with a processing capability of 72K UPH and the "TwinRevolve DBFC" for flip chips, supporting 60K UPH, thereby improving the productivity of manufacturing lines. With an accuracy of ±15μm (3sigma) and complete traceability compliant with SECS/GEM (E142), it contributes to the automation of semiconductor backend processes and reduction of TCOO (total cost of ownership). 【Features】 ■ Processing speed of 72K UPH and high-precision positioning of ±15μm (3sigma) ■ Compatible with bonding processes such as epoxy, DAF, WBC, and flip chips ■ Die traceability management compliant with SECS/GEM and E142 *For more details, please download the PDF or feel free to contact us.
- Company：株式会社 Found Four
- Price：Other
